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Chip Quik Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar)

Chip Quik Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar)

$ 39.57

Availability: 100 in stock
  • Item must be returned within: 30 Days
  • Return shipping will be paid by: Buyer
  • MPN: Does Not Apply
  • Accessory Type: Solder Paste / Tin Cream Mixer
  • Brand: Chip Quik
  • Condition: New
  • All returns accepted: Returns Accepted
  • Refund will be given as: Money Back

    Description

    Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Sn/Pb in 500g jar.
    Revolutionary Formula: No Refrigeration Required!
    Alloy: Sn63/Pb37
    Flux Type: Synthetic No-Clean
    Flux Classification: REL0
    Metal Content: 90.25% metal by weight.
    Particle Size: T4 (20-38 microns)
    Melting Point: 183C (361F)
    Size: 500g jar
    Shelf Life
    Refrigerated >12 months, unrefrigerated >12 months
    Stencil Life
    >8 hours @ 20-50% RH 22-28C (72-82F)
    >4 hours @ 50-70% RH 22-28C (72-82F)
    Stencil Cleaning
    Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
    Storage and Handling
    Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
    Transportation
    This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
    WARNING! This product can expose you to Lead, which is known to the State of California to cause Cancer, Birth Defects, or other Reproductive Harm. For more information, go to:
    www.P65Warnings.ca.gov
    This item is manufacturer made to order. Lead time is 3-5 days