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Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)

Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)

$ 42.21

Availability: 100 in stock
  • Accessory Type: Solder Paste / Tin Cream Mixer
  • All returns accepted: Returns Accepted
  • MPN: Does Not Apply
  • Condition: New
  • Refund will be given as: Money Back
  • Item must be returned within: 30 Days
  • Return shipping will be paid by: Buyer
  • Brand: Chip Quik

    Description

    Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Lead-Free SAC305 in 500g jar.
    Revolutionary Formula: No Refrigeration Required!
    Alloy: Sn96.5/Ag3.0/Cu0.5
    Flux Type: Synthetic No-Clean
    Flux Classification: REL0
    Metal Content: 88.5% metal by weight.
    Particle Size: T4 (20-38 microns)
    Melting Point: 217C (423F)
    Size: 500g jar
    Shelf Life
    Refrigerated >12 months, unrefrigerated >12 months
    Stencil Life
    >8 hours @ 20-50% RH 22-28C (72-82F)
    >4 hours @ 50-70% RH 22-28C (72-82F)
    Stencil Cleaning
    Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
    Storage and Handling
    Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.
    Transportation
    This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
    This item is manufacturer made to order. Lead time is 3-5 days